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Rao Tummala System on Package (Hardback) (UK IMPORT)
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C $432.24
ApproximatelyPHP 17,716.28
Condition:
Brand New
A new, unread, unused book in perfect condition with no missing or damaged pages.
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Does not post to United States.
Located in: GU14 0GT, United Kingdom
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eBay item number:395296829966
Item specifics
- Condition
- Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
- Format
- Hardcover
- Book Title
- System on Package : Miniaturization of the Entire System
- Publication Name
- System on Package
- Title
- System on Package
- EAN
- 9780071459068
- ISBN
- 9780071459068
- Publisher
- Mcgraw-Hill Education
- Release Year
- 2008
- Release Date
- 16/06/2008
- Language
- English
- Country/Region of Manufacture
- US
- Item Height
- 1.4 in
- Item Length
- 9.5 in
- Item Width
- 7.6 in
- Item Weight
- 57.1 Oz
- Genre
- Technology & Engineering
- Publication Year
- 2008
- Illustrator
- Yes
- Topic
- Electronics / Microelectronics, Telecommunications
- Number of Pages
- 785 Pages
About this product
Product Identifiers
Publisher
Mcgraw-Hill Education
ISBN-10
0071459065
ISBN-13
9780071459068
eBay Product ID (ePID)
54371287
Product Key Features
Book Title
System on Package : Miniaturization of the Entire System
Number of Pages
785 Pages
Language
English
Publication Year
2008
Topic
Electronics / Microelectronics, Telecommunications
Illustrator
Yes
Genre
Technology & Engineering
Format
Hardcover
Dimensions
Item Height
1.4 in
Item Weight
57.1 Oz
Item Length
9.5 in
Item Width
7.6 in
Additional Product Features
Intended Audience
Trade
LCCN
2008-016996
Table Of Content
Chapter 1. Introduction to the System-on-Package (SOP) Technology Chapter 2. Introduction to System-on-Chip (SOC) Chapter 3. Stacked ICs and Packages (SIP) Chapter 4. Mixed-Signal (SOP) Design Chapter 5. Radio Frequency System-on-Package (RF SOP) Chapter 6. Integrated Chip-to-Chip Optoelectronic SOP Chapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components Chapter 8. Mixed-Signal Reliability Chapter 9. MEMS Packaging Chapter 10. Wafer-Level SOP Chapter 11. Thermal SOP Chapter 12. Electrical Test of SOP Modules and Systems Chapter 13. Biosensor SOP Index
Synopsis
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where "systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
LC Classification Number
TK7870.15
Item description from the seller
Business seller information
Value Added Tax Number:
- GB 864 1548 11
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