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This listing was ended by the seller on Mon, 24 Jun at 4:31 PM because the item is no longer available.
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Heated Directly Reballing Stencil+63/37 Solder Paste for Samsung S8 Chip Repair - Picture 1 of 7
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Heated Directly Reballing Stencil+63/37 Solder Paste for Samsung S8 Chip Repair

xories
  • (26057)
US $19.07
ApproximatelyPHP 1,061.10
Was US $21.19 (10% off)What does this price mean?
Recent sales price provided by the seller
Condition:
New
Ended: Jun 24, 2024 16:31:10 PHT
3 available
    Postage:
    Free Standard Shipping from outside US.
    Located in: HK, Hong Kong
    Delivery:
    Estimated between Mon, 30 Sep and Thu, 17 Oct to 43230
    Estimated delivery dates - opens in a new window or tab include seller's handling time, origin ZIP Code, destination ZIP Code and time of acceptance and will depend on shipping service selected and receipt of cleared paymentcleared payment - opens in a new window or tab. Delivery times may vary, especially during peak periods.
    Returns:
    30 days return. Buyer pays for return shipping.
    Coverage:
    Read item description or contact seller for details. See all detailsSee all details on coverage
    (Not eligible for eBay purchase protection programmes)
    Report this item - opens in new window or tab
    Seller assumes all responsibility for this listing.
    eBay item number:355662579652

    Item specifics

    Condition
    New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is ...
    Brand
    Generic
    MPN
    10145240112100600
    Model
    BGA Heated Directly Stencil+50g Lead Solder Paste

    Item description from the seller

    xories

    xories

    100% positive feedback
    Seller's other itemsContact
    Joined Jan 2008