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Multichip Modules with Integrated Sensors - 9789401066310
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Located in: Aldershot, United Kingdom
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eBay item number:354850652066
Item specifics
- Condition
- Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
- Book Title
- Multichip Modules with Integrated Sensors
- ISBN
- 9789401066310
- Subject Area
- Mechanical Engineering, Electrical Engineering
- Publication Name
- Multichip Modules with Integrated Sensors
- Publisher
- Springer
- Subject
- Engineering & Technology
- Publication Year
- 2011
- Type
- Textbook
- Format
- Paperback
- Language
- English
- Item Height
- 240mm
- Item Width
- 160mm
- Item Weight
- 545g
- Number of Pages
- 336 Pages
About this product
Product Information
Advances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by the Technical University of Budapest, Budapest, Hungary, on May 18-20, 1995. Additionally, the Hungarian Chapter of ISHM-The Microelectronics Society held a poster session on this topic. This volume presents the majority of papers presented at the ARW and the ISHM-Hungary Session. The integration of sensors with high .performance MCM structures represent the trend for intelligent electronics. The book reviews advances in MCM technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. Developments in materials and processes for both MCM and sensors have lead to the enhanced performance of smart electronics. The work of the ARW, as demonstrated in the papers, addressed new materials development, characterized methods and high level integration of sensors into electronic packaging.
Product Identifiers
Publisher
Springer
ISBN-13
9789401066310
eBay Product ID (ePID)
128854409
Product Key Features
Subject Area
Mechanical Engineering, Electrical Engineering
Publication Name
Multichip Modules with Integrated Sensors
Format
Paperback
Language
English
Subject
Engineering & Technology
Publication Year
2011
Type
Textbook
Number of Pages
336 Pages
Dimensions
Item Height
240mm
Item Width
160mm
Volume
16
Item Weight
545g
Additional Product Features
Series Title
Nato Science Partnership Subseries: 3
Editor
Gabor Harsanyi, W.K. Jones
Country/Region of Manufacture
Netherlands
Item description from the seller
Business seller information
Value Added Tax Number:
- GB 976952259
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eBay item number:354850652066
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GBP 28.82 (approx PHP 2,168.68) | See import charges at checkout | United States | Expedited Postage (International Priority Shipping) | Estimated between Wed, 26 Jun and Thu, 4 Jul to 43230 |
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