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Quality Conformance and Qualification of Microelectroni
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Located in: Chandler, Arizona, United States
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Estimated between Sat, 25 May and Fri, 31 May to 43230
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eBay item number:255030990427
Item specifics
- Condition
- Brand New: A new, unread, unused book in perfect condition with no missing or damaged pages. See all condition definitionsopens in a new window or tab
- ISBN
- 9780471594369
- EAN
- 9780471594369
- Publication Year
- 1994
- Type
- Textbook
- Format
- Trade Paperback
- Language
- English
- Publication Name
- Quality Conformance and Qualification of Microelectronic Packages and Interconnects
- Item Height
- 1.2in
- Item Length
- 9.3in
- Publisher
- Wiley & Sons, Incorporated, John
- Item Width
- 6.1in
- Item Weight
- 31.3 Oz
- Number of Pages
- 496 Pages
About this product
Product Information
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Product Identifiers
Publisher
Wiley & Sons, Incorporated, John
ISBN-10
0471594369
ISBN-13
9780471594369
eBay Product ID (ePID)
1038763
Product Key Features
Publication Name
Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Format
Trade Paperback
Language
English
Publication Year
1994
Type
Textbook
Number of Pages
496 Pages
Dimensions
Item Length
9.3in
Item Height
1.2in
Item Width
6.1in
Item Weight
31.3 Oz
Additional Product Features
Lc Classification Number
Tk7870.15.Q35 1994
Table of Content
Three-Dimensional Stacked Dies. Cofired Ceramic Substrates. Organic Laminated Substrates and Chip-on-Board. High-Density Interconnects and Deposited Dielectrics. Wire and Wirebonds. Tape Automated Bonds. Flip-Chip Bonds. Device and Substrate Attachment. Cases. Leads. Lead Seals. Lid Seals. Material and Product Evaluation Methods. Rework Methods. Bibliography. Index.
Copyright Date
1994
Topic
Industrial Design / Packaging, Electronics / General, Quality Control
Lccn
93-009709
Dewey Decimal
621.381046
Intended Audience
Scholarly & Professional
Dewey Edition
20
Illustrated
Yes
Genre
Technology & Engineering
Item description from the seller
Seller assumes all responsibility for this listing.
eBay item number:255030990427
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Item location:
Chandler, Arizona, United States
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| Postage and handling | To | Service | Delivery*See Delivery notes |
|---|---|---|---|
| US $4.99 (approx PHP 290.56) | United States | Economy Postage (USPS Media MailTM) | Estimated between Sat, 25 May and Fri, 31 May to 43230 |
| Handling time |
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| Will usually ship within 1 business day of receiving cleared payment. |
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